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IC Packaging Case Study |
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(a) OP；(b) SEM；(c) Metal fingers formation on FPC ；(d) Photo mask inspection |
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Optical Microscope |
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Non Contact 3D Surface Profiler |
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Applications |
- Flatness, surface roughness, step height, deformation and waviness
- 2-D and 3-D profile
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Advantages |
- Accurate, fast and no sample preparation is needed
- An extremely wide range of surface heights is capable to be profiled. (~180μm)
- The benefits of optical surface profilometry include
- Excellent height resolution
- High measurement speed
- Ability to perform non-contact measurements of delicate surfaces
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Surface defects characterization |
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(a) OP；(b) SEM；(c) LED ；(d) Au Bump |
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100 μm Bump Profiler
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20 μm Bump Profile
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X-ray Photography |
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Applications |
This system was designed specifically for the PCB Assembly Market
- BGA Inspectin
- Solder Interconnects of Active & Passive Components
- Voiding Calculation
- Hybrid Components
Additionally, useful for inspection of electromechanical components, which are encapsulated
- Sensors
- Relays
- Fuses
- Coils
- Wirebonds
- Die-Attach
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Strength |
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X-ray Photography Examples |
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Scanning Acoustic Microscope |
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MA-tek system is featured by 3D imaging, real-time 3D imaging, 0.5 um high resolution, 1000 mm/sec high speed, A-scan, B-scan, C-scan, S-image, and T-scan.
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Product Failure Analysis |
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(a)I-V Curve；(b)SAT；(c)X-ray；(d)SEM；(e)SEM；(f)SEM |
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SEM Imaging |
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SEM/EDX Mapping Analysis |
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Failed Bump after Reliability Testing |
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| (a)OM Image of Post FIB Cutting；(b)FIB cross-sectioning ；(c)TEM Image |
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High Resistance Bumping Issue |
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SIMS Applications |
 (a)CAMECA ims-6f ；High Transmission and High Mass Resolution (b)ATOMIKA sims 4500；High Depth Resolution, Ultra-Shallow Junction
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(a)Ultra Shallow Junction |
(b)High Depth Resolution |
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Total Solution of ESD Service |
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Wide Span of Service Scope |
- Various testing modes [HBM, MM, socket CDM, non-socket CDM, latch-up]
- Room temperature and high temperature testing facility (-20℃ - 225℃)
- Dynamic Latch-up testing capability - vector input board with high frequency
- Universal BGA socket for ESD/Latch-up testing
- COB testing and packaged IC (BGA, QFN, QFP, DIP, TSOP...etc.) testing
- Wire bonding and packaging services
- [Au/Al wiring, die mount, epoxy encapsulation]
- System level testing of module, mother board, and electronic system by ESD gun
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Customized Service |
- Establishment of ESD/Latch-up design rules
- Design of I/O cell library, specific pad circuitry
- Consultancy of ESD protection scheme
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Cycle Time Commitment |
- Report delivery in 24 hrs, total testing time ≦ 5 hrs
- Report delivery in 48 hrs, total testing time ≦ 15 hrs
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