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LED Industry |
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Reliability Testing |
Reliability Testing Service |
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LED Reliability Testing Facilities |
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ESD, Latch-up, Testing/Wire Bonding |
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LED ESD Testing |
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X-ray Inspection |
X-ray Photography |
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X-ray lnspection of LED |
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Failure Analysis (FA) |
Thermal, EMMI/InGaAs,OBIRCH |
Defect Localization by EMMI/InGaAs, OBIRCH
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EMMI/InGaAs, OBIRCH for FA Application
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Texturing (Surface Morphology) |
Optical Profiler |
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Texturing (Surface Morphology) |
![]() Surface morphology of LED die surface roughness after RIE etching or ion bombardment. |
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Chip Structure and Film Thickness |
SEM, DB-FIB, TEM |
![]() X-S view SEM |
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Chip Structure and Film Thickness |
![]() Precise X-S view by DB-FIB |
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![]() X-S view TEM |
![]() (a)MQW and super lattice;(b)HR TEM of MQW;(c)PSS and buffer layer |
Crystalline Defects (Dislocations) |
X-S TEM, P-V TEM |
![]() TEM Imaging (Dislocations in epitaxial butter layer) |
![]() X-S & P-V TEM at requested area to observe the dislocation density and its spatial distribution |
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Depth Profiling of Elemental Analysis |
TEM/EDX, SIMS |
EM/EDX Line Profile – Blue LED – MQW and Superlattice
![]() In% in superlattice can be defected down to 0.2at% |
Elemental Depth profile by SIMS
![]() SIMS is also feasible now. |