2D X-ray
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Technical Concept |
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2D X-ray imaging is shining X-ray radiation on an object of interest and taking its transmission contrast. |
It can be used to inspect an IC’s internal metallic materials or structure, such as bond wire, silver glue, lead frame, etc.
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Equipment |
MA-tek has Feinfocus FXS-160.40 TIGER X-RAY and Dage XD7600NT.
FXS-160.40 |
Window control screen |
Dage XD 7600NT |
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Application |
X-ray is mainly used for examination of PCB assembly failures
- Examination of solder on active/passivity components
- Number of holes and ratio counting
- Mixing-system components
The devices we could analyze：
- Inductors/Sensors
- Relay
- Fuse
- Coils/Winding
- Bond wire
- IC and die adhesion interface inspection
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(a) 0° Tilt, 0° Rotate；(b) 55° Tilt, 45° Rotate；(c) 55° Tilt, 135° Rotate；(d) 55° Tilt, 225° Rotate；(e) 55° Tilt, 315° Rotate
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