Environmental Stress Test
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Environmental stress tests are used to validate the quality of packaged devices. |
There are several aspects to be considered, such as the endurance of temperature level of the package, the level of thermal resistance and moisture sensitivity of the package, and the storage and control. From device production to delivery to the customer, the first thing faced is thermal stress during the surface mount technology (SMT) or dual in-line package (DIP) assembly process. After that, the lifetime is taken into account.
Furthermore, since the Earth's environment is continuously polluted by humans. The acidification of the air and rain affects the lifetime of many parts. Therefore, environmental testing to check the resistance of corrosion on exposed parts, such as connectors, PCB parts, terminals, and metal products is a necessity. The device level environmental stress test services provided by MA-tek are described as follows:
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Moisture Sensitivity Level（MSL） |
Mainly used on surface mounted devices (SMD) or components that need to be assembly through the SMT reflow procedure. The moisture sensitivity level is determined through scanning acoustic tomography (SAT) or scanning acoustic microscopy (SAM) to detect delamination location and areal percentage.
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Precondition Test |
The testing is similar to that of the Moisture Sensitivity Level. However, the purpose is different. Precondition aims to simulate the process starting from the manufacturing of the parts, transportation, and usage on the customer side.
The test condition is according to the moisture sensitivity of the product. Based on the industry experience and due to the similarity of both test processes, most the parts manufacturers merge these two tests into one test.
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Temperature Cycling Test |
Temperature cycle testing is a relatively important reliability test that alternates cycles between hot and cold temperatures. Due to the difference in thermal expansion coefficients among materials be used, the temperature cycle results in mechanical stress and causes fatigue. This stress is similar to the ON-OFF cycles of the product in daily operation.
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High Temperature Storage Test |
The purpose of this test is to verify the thermal resistance of the packaging materials in a continuous high temperature environment. The high temperature accelerates the thermal aging process of the material.
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Temperature Storage Test |
The purpose of this test is to verify the thermal resistance of the packaging materials in a continuous low temperature environment. At low temperatures, material losses its ductility. The contraction at low temperature results in mechanical stress which may induce material cracking.
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Temperature Humidity Storage Test |
Products are placed in a hot and humid environment to accelerate the chemical reaction which will result in corrosion. In addition to the environment test without biasing the product, electrical bias is often applied to the package with metal to check the ion migration and at the same time to check the corrosion resistance of the product.
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Highly Accelerated Stress Test |
Similar, in principle, to the temperature humidity storage test, this test puts the product at higher temperatures and higher water vapor pressure which is larger than the atmospheric pressure. The high temperature and water vapor pressure accelerate corrosion rate in package and result in internal corrosion in bad packaged products.
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Pressure Cooker Test |
This test provides water vapor press at 2 atm to verify the process quality of the products. It is not a reasonable way to test the reliability of the product. Because some portions of the material, such as the BGA substrate, may lead to excessive damage.
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Thermal Shock Test / Liquid to Liquid |
In principle, this is similar to the temperature cycle test. The difference is the temperature change is faster. This test checks the resistance of the product to the extreme change between the low temperature and high temperature. The cracking of the package sealing, grain combing, wire bonding, and the substrate can be tested.
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Thermal Shock Test / Air to Air |
This is for products of larger sizes. Unlike the temperature cycle test, Temperature changes in a short period of time by moving the product from one camber to the other chamber. It is a more representative test for the verification of automobile products.
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Salt Spray Test |
The test is mainly used to simulate the corrosion of metal portion of a product in a harsh environment. The quality of the surface treatment of the metal can be tested. When the product is used in the island area or in a high salinity environment, failure of the electrical contact resulted from the corrosion is happened frequently. The test can quickly verify the quality of the product by accelerating the corrosion.
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Gas Corrosion Test |
Air pollution due to emissions of exhaust is harmful to all types of electronic products. The main purpose of the gas corrosion test is to test the resistance of the surface plating or coating of products to the corrosive gas. Unlike the salt spray test, gas corrosion test is closer to the actual environment.
MA-tek recruits senior industry personnel, who have many years of experience with semiconductor reliability testing, to offer customers satisfied service but also set up a dedicated window to provide experimental design and overall planning. To ensure utmost experimental quality, MA-tek purchase internationally renowned equipments to provide customers with the best and most accurate test results. According to product specifications and customer requirements, MA-tek can perform MIL-STD, JEDEC, IEC, JESD, AEC, EIA and other different standard reliability tests.
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ESPEC TSA-71H |
ESPEC TSB-51 |
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ESPEC EHS 221MD |
ESPEC PV-231M |
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ESPEC PL-4KP |
台技SMD-10-M16HAO |
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