SEM
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Technical Concept |
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Scanning Electron Microscopy (SEM) is powerful to inspect the surface topography and microstructure of solid samples. |
MA-tek provides many high-resolution FE-SEM（Field Emission-SEM）, such as Hitachi S-4800 and S-8020. It can be used for inspecting a selected layer of an IC sample with skillful delayering and a cross-section of that with CP（ion milling）.
The magnification of SEM is up to several hundreds of a thousand times. A selected additional component of energy dispersive spectrometer（EDS）of X-ray provides a semi-quantitative identification of sample elements and thus great information on material compositions and impurities.
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Equipment |
S-4800 |
S-8020 |
SU-8220 |
SU-8220 |
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Applications |
- Planar and cross-sectional inspection for the microstructure on various sample surfaces.
- Multilayer sample inspection with precise thickness measurement.
- Qualitative and semi-quantitative analysis of sample element distribution.
- Low voltage SEM can be used for passive voltage contrast (PVC), applied for failure analysis to locate the areas of poor metal contact, leakage, and high resistance.
- Many local SEM images can be reconstructed to a global image. Such technology combined with a delayering process can be used for global images of each IC layer. Cross-comparing such optical microscopy images provide great information for reverse engineering of circuits.
- Providing a precise inspection for failures located by EMMI (Emission Microscope) or OBIRCH (Optical Beam Induced Resistance Change).
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Contact |
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