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TDR

Technical Concept

Time Domain Reflectometry (TDR) technology is performed by sending a signal with stair voltage to a metal wire and then measuring the reflected signal, calculating the corresponding reflection position by obtaining the duration between input and reflected signals.

When an electric signal propagating on a homologous medium (ex. Cu wire) faces a barrier (defects or any local impedance variation), part of the signal reflects and the left part continues. This phenomenon is used to design time domain reflectometry (TDR). This technology is performed by sending a signal with stair voltage to a metal wire and then measuring the reflected signal. The impedance variation along the transport path can be calculated based on the voltage differences of the reflected signal. In addition, a sensor is used to obtain the duration between input and reflected signals for calculating the corresponding reflection position.

Nowadays TDR has been an important technology for the failure analysis (FA) of IC chips. Such analysis can be combined with other technologies, such as scanning acoustic tomography (SAT) and X-ray microscopy for more detailed non-destructive FA.

Contact

Taiwan Lab

EMMI team

: +886-3-6116678 ext：3910/3911

: +886-952-301-632

: hc_efa@ma-tek.com

Non-destructive Analysis (NDA)

OM

3D OM

UV-OM

2D X-ray

3D X-ray

SAT

OP

TDR

TDR