Mechanical Stress Test
In addition to the usual environmental life test, the mechanical stress test can also be performed. Before discussing the mechanical stress tests, you must first understand the impact of solderability, mainly because most of the components required and the PCB are often welded. The solderability test under J-STD-002 standards is noted as follows：
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Preconditioning |
The main objective of preconditioning is to see if the normal levels of solder are still prevalent after storage. The latest pre-treatment conditions recommended temperature baking mode condition E, which is carried out in a way as follows :
 J-STD-002 |
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Solderability Test |
Specification defines test methods including tin CHANNEL solder pot bath, wetting method (Solder Bath / DIP), surface mount simulation (Surface Mount Simulation Test), etc, in which surface mount simulation method is the most common and mainstream. PCB Pad size design also has standards.
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Common Mechanical Stress Tests |
- Heat Resistance
- Lead Fatigue
- Push Strength Test
- Peel Strength Test
- Pull Strength Test
- Bond Shear / Pull Test
In addition, since some parts of monomer structure belongs to the Cavity Package, bare packages, unlike conventional sealed packages, are especially the need for these type of parts following the stress test and are a typical representative of the CMOS sensor parts and micro-electromechanical (MEMS)：
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Vibration test |
The JEDEC 020 specifications based, moisture sensitivity level of distinction is aimed at parts after unpacking the supremacy of the Line of Control production time, whose aim is to avoid excessive moisture causing popcorn parts or delamination, which damage lead parts. Due to different materials and structures, soak and reflow simulation is used to find the moisture sensitivity level, and provide users with the appropriate time production control.
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Precondition Test |
Testing the mode and the humidity level have similarities and differences. Pretreatment aims for analog parts from the production, and transportation, using this line to the customer cycle. Moisture conditions are sensitive to pre-treatment levels based on parts from the humidity, but the process is similar to many parts of the industry based on the experience of these two vendors merging.
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High Temperature Storage Test |
The purpose of this test is to verify the status of the thermal aging packaging materials in a continuous high temperature state, simulating accelerated aging.
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Low Temperature Storage Test |
The purpose of this test is to verify the status of low temperature packaging materials by exposing them to very low temperatures and using expansion and contraction through mechanical vibrations. This will test to see if cracks are caused.
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Temperature Humidity Storage Test |
Products are placed in a hot and humid environment to induce corrosion. In addition to the static test environment often with a bias ion test package, the metal material migration can also be synchronized to test the corrosion resistance of the product.
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Highly Accelerated Stress Test |
Similar in principle to the temperature humidity storage test, this test puts the product in different humidity environments, and differing temperatures simulate different atmospheric pressure and accelerates corrosion rate, and bad packages of products will have internal corrosion.
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Pressure Cooker Test |
This test simulates two atmospheric environments commonly experienced by products to verify the reliability of the products. Failure of this test in portions of the material, such as the BGA substrate, can easily lead to excessive damage.
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Temperature Cycle Test |
Temperature cycle testing is a reliability test that alternates between hot and cold temperatures through coefficients of expansion several cycles, and fatigue is measured afterward. This is the most commonly used reliability test. This test simulates two atmospheric environments commonly experienced by products to verify the reliability of the products. Failure of this test in portions of the material, such as the BGA substrate, can easily lead to excessive damage.
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Thermal Shock Test / Liquid to Liquid |
Similar in principle to the temperature cycle test, this test focuses on accelerating the rate of temperature change. The product is exposed to extreme high and low temperatures and will be tested for sealing, grain combines, wire bindings, crack, and other defects in the substrate.
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Salt Spray Test |
The salt spray test is mainly used on analog parts to simulate a harsh environment which leads to corrosion. The test is mainly used to determine metal surface quality for products used in high salinity environments, and the test can quickly verify the quality of the product by accelerating corrosion.
MA-tek recruits senior industry personnel who have many years of experience with semiconductor reliability testing, to offer customers superior service but also build an Integrated Technology Services dedicated window, to provide experimental design and overall planning. To ensure the utmost experimental quality, the company uses internationally renowned equipment to provide customers with the best and most accurate test results. According to product specifications and customer requirements, MA-tek can perform MIL-STD, JEDEC, IEC, JESD, AEC, EIA, and other different standard reliability tests.
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Wire pull & ball shear / Lead Fatigue / Full function test
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