Delayer & Parallel Lapping
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Technical Concept |
This technology uses chemical solution/gas etching and mechanical polish to gradually remove different metal and oxide layers inside an IC chip. It can also be used to expose a selected layer when needed.
Parallel lapping uses a chemical solution, etching gases, or mechanical polish to remove materials layer by layer including metal and oxide layers. Parallel lapping at a specific layer of interest can be well controlled.
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Equipment |
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Reactive ion etcher (RIE)
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Polish equipment
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Applications |
Ma-tek is a professional in IC delayer [parallel lapping] with three different processes：
- Chemical wet etching
- RIE dry etching
- Mechanical polish
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OM Imaging
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SEM Imaging
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