IC封裝/測試應用實例 |
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(a) OP;(b) SEM;(c) Metal fingers formation on FPC ;(d) Photo mask inspection |
Optical Microscope |
Non Contact 3D Surface Profiler |
Applications |
- Flatness, surface roughness, step height, deformation and waviness
- 2-D and 3-D profile
Advantages |
- Accurate, fast and no sample preparation is needed
- An extremely wide range of surface heights is capable to be profiled. (~180μm)
- The benefits of optical surface profilometry include
- Excellent height resolution
- High measurement speed
- Ability to perform non-contact measurements of delicate surfaces
Surface defects characterization |
(a) OP;(b) SEM;(c) LED ;(d) Au Bump |
100 μm Bump Profiler |
20 μm Bump Profile |
X-ray Photography |
Applications |
This system was designed specifically for the PCB Assembly Market
- BGA Inspectin
- Solder Interconnects of Active & Passive Components
- Voiding Calculation
- Hybrid Components
Additionally, useful for inspection of electromechanical components, which are encapsulated
- Sensors
- Relays
- Fuses
- Coils
- Wirebonds
- Die-Attach
Strength |
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X-ray Photography Examples |
Scanning Acoustic Microscope |
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MA-tek system is featured by 3D imaging, real-time 3D imaging, 0.5 um high resolution, 1000 mm/sec high speed, A-scan, B-scan, C-scan, S-image, and T-scan.
Product Failure Analysis |
(a)I-V Curve;(b)SAT;(c)X-ray;(d)SEM;(e)SEM;(f)SEM |
SEM Imaging |
SEM/EDX Mapping Analysis |
Failed Bump after Reliability Testing |
(a)OM Image of Post FIB Cutting;(b)FIB cross-sectioning ;(c)TEM Image |
High Resistance Bumping Issue |
SIMS Applications |
(a)CAMECA ims-6f ;High Transmission and High Mass Resolution (b)ATOMIKA sims 4500;High Depth Resolution, Ultra-Shallow Junction
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(a)Ultra Shallow Junction |
(b)High Depth Resolution |
Total Solution of ESD Service |
Wide Span of Service Scope |
- Various testing modes [HBM, MM, socket CDM, non-socket CDM, latch-up]
- Room temperature and high temperature testing facility (-20℃ - 225℃)
- Dynamic Latch-up testing capability - vector input board with high frequency
- Universal BGA socket for ESD/Latch-up testing
- COB testing and packaged IC (BGA, QFN, QFP, DIP, TSOP...etc.) testing
- Wire bonding and packaging services
- [Au/Al wiring, die mount, epoxy encapsulation]
- System level testing of module, mother board, and electronic system by ESD gun
Customized Service |
- Establishment of ESD/Latch-up design rules
- Design of I/O cell library, specific pad circuitry
- Consultancy of ESD protection scheme
Cycle Time Commitment |
- Report delivery in 24 hrs, total testing time ≦ 5 hrs
- Report delivery in 48 hrs, total testing time ≦ 15 hrs